FI-XPB30SRL-HF11 - JAE Electronics

Manufacturer Part Number:FI-XPB30SRL-HF11
Manufacturer:JAE Electronics
Part of Description:CONN RCPT 30P 0.039 GOLD SMD R/A
Lead Free Status / RoHS Status:Lead Free / RoHS Compliant
Stock Condition:893 In Stock
Ship From:Hong Kong
Shipment Way:DHL/Fedex/TNT/UPS/EMS
REMARK
Buy the FI-XPB30SRL-HF11 JAE Electronics on xunyun-ic.com, JAE Electronics is a top 10 global interconnect supplier and a recognized technology leader in fine pitch board to board, board to cable (including LVDS products), FPC (board-to-flex), memory card, input/output, circular, automotive/transportation and waterproof rated connectors....

Specification

TypeDescription
SeriesFI-XP
PackageTray
Part StatusObsolete
Connector TypeReceptacle
Contact TypeNon-Gendered
StyleBoard to Cable/Wire
Number of Positions30
Number of Positions LoadedAll
Pitch - Mating0.039" (1.00mm)
Number of Rows1
Row Spacing - Mating-
Mounting TypeBoard Edge, Cutout; Bottom Mount, Surface Mount, Right Angle, Reverse Mount
TerminationSolder
Fastening TypeFriction Lock
Contact Finish - MatingGold
Contact Finish Thickness - Mating12.0µin (0.30µm)
Insulation ColorBlack
Insulation Height-
Contact Length - Post-
Operating Temperature-
Material Flammability RatingUL94 V-0
Contact Finish - PostTin
Mated Stacking Heights-
Ingress Protection-
FeaturesGrounding Pins, Shielded, Solder Retention
Current Rating (Amps)-
Voltage Rating-
All the Electronics Components will be packing in very safely by ESD antistatic protection.

package

BUYING OPTIONS

Stock Status: 893

Minimum: 1

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