ESQT-138-03-H-6-375 - Samtec, Inc.

Manufacturer Part Number:ESQT-138-03-H-6-375
Manufacturer:Samtec, Inc.
Part of Description:CONN SOCKET 228P 0.079 GOLD PCB
Lead Free Status / RoHS Status:Lead Free / RoHS Compliant
Stock Condition:3069 In Stock
Ship From:Hong Kong
Shipment Way:DHL/Fedex/TNT/UPS/EMS
REMARK
Buy the ESQT-138-03-H-6-375 Samtec, Inc. on xunyun-ic.com, Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine sys...

Specification

TypeDescription
SeriesESQT
PackageBulk
Part StatusActive
Connector TypeElevated Socket
Contact TypeForked
StyleBoard to Board or Cable
Number of Positions228
Number of Positions LoadedAll
Pitch - Mating0.079" (2.00mm)
Number of Rows6
Row Spacing - Mating0.079" (2.00mm)
Mounting TypeThrough Hole
TerminationSolder
Fastening TypePush-Pull
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Insulation ColorBlack
Insulation Height0.375" (9.53mm)
Contact Length - Post0.083" (2.11mm)
Operating Temperature-55°C ~ 125°C
Material Flammability RatingUL94 V-0
Contact Finish - PostGold
Mated Stacking Heights-
Ingress Protection-
Features-
Current Rating (Amps)4.5A per Contact
Voltage Rating-
All the Electronics Components will be packing in very safely by ESD antistatic protection.

package

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