558-10-500M30-001104 - Preci-Dip

Manufacturer Part Number:558-10-500M30-001104
Manufacturer:Preci-Dip
Part of Description:BGA SURFACE MOUNT 1.27MM
Lead Free Status / RoHS Status:Lead Free / RoHS Compliant
Stock Condition:139 In Stock
Ship From:Hong Kong
Shipment Way:DHL/Fedex/TNT/UPS/EMS
REMARK
Buy the 558-10-500M30-001104 Preci-Dip on xunyun-ic.com, Preci-Dip packs unequaled expertise into cutting-edge interconnect components. Leveraging advanced designs, and top materials, with incomparable Swiss precision,Preci-Dip’s precision tools and contact assembly machines are developed, designed, and produced with passion and expertise. These experts...

Specification

TypeDescription
Series558
PackageBulk
Part StatusActive
TypeBGA
Number of Positions or Pins (Grid)500 (30 x 30)
Pitch - Mating0.050" (1.27mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Material - MatingBrass
Mounting TypeSurface Mount
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.050" (1.27mm)
Contact Finish - PostGold
Contact Finish Thickness - Post10.0µin (0.25µm)
Contact Material - PostBrass
Housing MaterialFR4 Epoxy Glass
Operating Temperature-55°C ~ 125°C
All the Electronics Components will be packing in very safely by ESD antistatic protection.

package

BUYING OPTIONS

Stock Status: 139

Minimum: 1

Price: $51.70734

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