130-028-050 - 3M

Manufacturer Part Number:130-028-050
Manufacturer:3M
Part of Description:CONN IC DIP SOCKET 28POS GOLD
Lead Free Status / RoHS Status:Lead Free / RoHS Compliant
Stock Condition:1994 In Stock
Ship From:Hong Kong
Shipment Way:DHL/Fedex/TNT/UPS/EMS
REMARK
Buy the 130-028-050 3M on xunyun-ic.com, 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR)...

Specification

TypeDescription
Series100
PackageBulk
Part StatusObsolete
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)28 (2 x 14)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating8.00µin (0.203µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - PostFlash
Contact Material - PostBrass
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Operating Temperature-65°C ~ 125°C
All the Electronics Components will be packing in very safely by ESD antistatic protection.

package

BUYING OPTIONS

Stock Status: 1994

Minimum: 1

Call for price or submit a RFQ

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