CTS Corporation / APF19-19-10CB

Manufacturer Part Number: APF19-19-10CB
Manufacturer: CTS Corporation
Part of Description: HEATSINK LOW-PROFILE FORGED
Lead Free Status / RoHS Status: Lead Free / RoHS Compliant
Stock Condition: 1935 In Stock
Ship From: Hong Kong
Shipment Way: DHL/Fedex/TNT/UPS/EMS
REMARK
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Specification

TypeDescription
SeriesAPF
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Not Included)
ShapeSquare, Fins
Length0.748" (19.00mm)
Width0.748" (19.00mm)
Diameter-
Fin Height0.370" (9.40mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow5.30°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized
All the Eelctronics Components will be packing in very safely by ESD antistatic protection.

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