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| Manufacturer Part Number: | TC1-200G |
| Manufacturer: | Chip Quik, Inc. |
| Part of Description: | HEAT SINK COMPOUND - HIGH DENSIT |
| Lead Free Status / RoHS Status: | Lead Free / RoHS Compliant |
| Stock Condition: | 1558 In Stock |
| Ship From: | Hong Kong |
| Shipment Way: | DHL/Fedex/TNT/UPS/EMS |
| Type | Description |
|---|---|
| Series | - |
| Package | Bulk |
| Part Status | Active |
| Type | Silicone Compound |
| Size / Dimension | 200 gram Jar |
| Usable Temperature Range | - |
| Color | White |
| Thermal Conductivity | 0.67W/m-K |
| Features | - |
| Shelf Life | 60 Months |
| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
