CPU .63X.63 - Henkel / Bergquist

Manufacturer Part Number:CPU .63X.63
Manufacturer:Henkel / Bergquist
Part of Description:THERM PAD 16MMX16MM TAN
Lead Free Status / RoHS Status:Lead Free / RoHS Compliant
Stock Condition:3313 In Stock
Ship From:Hong Kong
Shipment Way:DHL/Fedex/TNT/UPS/EMS
REMARK
Buy the CPU .63X.63 Henkel / Bergquist on xunyun-ic.com, Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce a...

Specification

TypeDescription
SeriesCPU Pad™
Package-
Part StatusObsolete
UsageCPU
TypePad, Sheet
ShapeSquare
Outline16.00mm x 16.00mm
Thickness0.0050" (0.127mm)
Material-
Adhesive-
Backing, Carrier-
ColorTan
Thermal Resistivity-
Thermal Conductivity0.6W/m-K
All the Electronics Components will be packing in very safely by ESD antistatic protection.

package

BUYING OPTIONS

Stock Status: 3313

Minimum: 1

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