CPU 1.375X1.375 - Henkel / Bergquist

Manufacturer Part Number:CPU 1.375X1.375
Manufacturer:Henkel / Bergquist
Part of Description:THERM PAD 34.93MMX34.93MM TAN
Lead Free Status / RoHS Status:Lead Free / RoHS Compliant
Stock Condition:4463 In Stock
Ship From:Hong Kong
Shipment Way:DHL/Fedex/TNT/UPS/EMS
REMARK
Buy the CPU 1.375X1.375 Henkel / Bergquist on xunyun-ic.com, Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce a...

Specification

TypeDescription
SeriesCPU Pad™
Package-
Part StatusObsolete
UsageCPU
TypePad, Sheet
ShapeSquare
Outline34.93mm x 34.93mm
Thickness0.0050" (0.127mm)
Material-
Adhesive-
Backing, Carrier-
ColorTan
Thermal Resistivity-
Thermal Conductivity0.6W/m-K
All the Electronics Components will be packing in very safely by ESD antistatic protection.

package

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