CPU 1.375X1.375 - Henkel / Bergquist

Manufacturer Part Number:CPU 1.375X1.375
Manufacturer:Henkel / Bergquist
Part of Description:THERM PAD 34.93MMX34.93MM TAN
Lead Free Status / RoHS Status:Lead Free / RoHS Compliant
Stock Condition:4463 In Stock
Ship From:Hong Kong
Shipment Way:DHL/Fedex/TNT/UPS/EMS
REMARK
Buy the CPU 1.375X1.375 Henkel / Bergquist on xunyun-ic.com, Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce a...

Specification

TypeDescription
SeriesCPU Pad™
Package-
Part StatusObsolete
UsageCPU
TypePad, Sheet
ShapeSquare
Outline34.93mm x 34.93mm
Thickness0.0050" (0.127mm)
Material-
Adhesive-
Backing, Carrier-
ColorTan
Thermal Resistivity-
Thermal Conductivity0.6W/m-K
All the Electronics Components will be packing in very safely by ESD antistatic protection.

package

BUYING OPTIONS

Stock Status: 4463

Minimum: 1

Call for price or submit a RFQ

Related Henkel / Bergquist Components

EYG-A091205V
EYG-A091205V Panasonic

THERM PAD 115MMX90MM W/ADH GRAY...

EYG-S1316ZLAC
EYG-S1316ZLAC Panasonic

THERM PAD 163MMX125MM GRAY...

60-11-D397-T500
60-11-D397-T500 Parker Chomerics

CHO-THERM T500 TO-220 0.010"...

SP400-0.009-00-54
SP400-0.009-00-54 Henkel / Bergquist

THERM PAD 19.05MMX12.7MM GRAY...

A17733-19
A17733-19 Laird - Performance Materials

TFLEX P1190...

36.83MM-33.02MM-25-5590H-05
36.83MM-33.02MM-25-5590H-05 3M

THERM PAD 36.83MMX33.02MM 1=25PK...

Top