HF115AC-0.0055-AC-90 - Henkel / Bergquist

Manufacturer Part Number:HF115AC-0.0055-AC-90
Manufacturer:Henkel / Bergquist
Part of Description:THERM PAD 21.84MMX18.79MM W/ADH
Lead Free Status / RoHS Status:Lead Free / RoHS Compliant
Stock Condition:50050 In Stock
Ship From:Hong Kong
Shipment Way:DHL/Fedex/TNT/UPS/EMS
REMARK
Buy the HF115AC-0.0055-AC-90 Henkel / Bergquist on xunyun-ic.com, Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce a...

Specification

TypeDescription
SeriesHi-Flow® 115-AC
PackageBulk
Part StatusActive
UsageTO-218, TO-220, TO-247
TypePad, Sheet
ShapeRectangular
Outline21.84mm x 18.79mm
Thickness0.0055" (0.140mm)
MaterialPhase Change Compound
AdhesiveAdhesive - One Side
Backing, CarrierFiberglass
ColorGray
Thermal Resistivity0.35°C/W
Thermal Conductivity0.8W/m-K
All the Electronics Components will be packing in very safely by ESD antistatic protection.

package

BUYING OPTIONS

Stock Status: 50050

Minimum: 1

Price: $0.10000

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