B30353D5077Y221 - RF360 - A Qualcomm-TDK joint venture

Manufacturer Part Number:B30353D5077Y221
Manufacturer:RF360 - A Qualcomm-TDK joint venture
Part of Description:RF MODULE DIVERSITY
Lead Free Status / RoHS Status:Lead Free / RoHS Compliant
Stock Condition:4763 In Stock
Ship From:Hong Kong
Shipment Way:DHL/Fedex/TNT/UPS/EMS
REMARK
Buy the B30353D5077Y221 RF360 - A Qualcomm-TDK joint venture on xunyun-ic.com, RF360 - A Qualcomm-TDK joint venture offers a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed i...

Specification

TypeDescription
Series*
PackageTray
Part StatusObsolete
RF Family/Standard-
Protocol-
Modulation-
Frequency-
Data Rate-
Power - Output-
Sensitivity-
Serial Interfaces-
Antenna Type-
Utilized IC / Part-
Memory Size-
Voltage - Supply-
Current - Receiving-
Current - Transmitting-
Mounting Type-
Operating Temperature-
Package / Case-
All the Electronics Components will be packing in very safely by ESD antistatic protection.

package

BUYING OPTIONS

Stock Status: 4763

Minimum: 1

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