B38791W1155W310 - RF360 - A Qualcomm-TDK joint venture

Manufacturer Part Number:B38791W1155W310
Manufacturer:RF360 - A Qualcomm-TDK joint venture
Part of Description:SAW DUPLEXER SMD
Lead Free Status / RoHS Status:Lead Free / RoHS Compliant
Stock Condition:2013 In Stock
Ship From:Hong Kong
Shipment Way:DHL/Fedex/TNT/UPS/EMS
REMARK
Buy the B38791W1155W310 RF360 - A Qualcomm-TDK joint venture on xunyun-ic.com, RF360 - A Qualcomm-TDK joint venture offers a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed i...

Specification

TypeDescription
Series*
PackageTape & Reel (TR)
Part StatusObsolete
Type-
Frequency Bands (Low / High)-
Low Band Attenuation (min / max dB)-
High Band Attenuation (min / max dB)-
Return Loss (Low Band / High Band)-
Mounting Type-
Package / Case-
All the Electronics Components will be packing in very safely by ESD antistatic protection.

package

BUYING OPTIONS

Stock Status: 2013

Minimum: 1

Call for price or submit a RFQ

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